Author: SMTELECTROTECH

pcb developing machine 　　The developing machine is a printing processing equipment that partially or completely completes the development, washing, gluing, drying and other processes of the printed printing plate through a semi-automatic and fully automatic procedure. Generally consists of transmission system, developing system, washing system, drying system, program control system and other parts. How to …

Electroplating of metal products can be described by the following process flow: Loading→ degreasing, water washing → rust removal, water washing → activation, water washing → electroplating → water washing → drying → inspection → packaging. Among the electroplating, common ones are: zinc plating, copper plating, nickel plating, gold plating, silver plating, tin plating, rhodium …

What kind of function does the automatic galvanizing production line have? Nowadays, many manufacturers use fully automatic hot-dip galvanizing production line, because the cost of the product is relatively low, and its recovery rate is also very high, the general full-automatic galvanizing line production line is 25 cm, the tank The width is 18 cm, …

The conveying wheel and suction roller in the etching tank should be cleaned frequently and kept clean. If the conveying wheel and suction roller are cleaned once a day, the etching tank and the duct part need to be cleaned regularly every one to two weeks. This is the key to manufacturing high-density circuit boards. …

Etching is a technique in which materials are removed by chemical reaction or physical impact. Etching techniques can be divided into two types: wet etching and dry etching. It can be used to remove the protective film of the area to be etched after exposure, plate making and development, and contact with chemical solutions during …

The characteristic of plastic electroplating is that it does not conduct electricity. It needs to be electrically conductive first, namely activation and electroless plating, so that a layer of metal film is firmly attached to the surface, and the subsequent electroplating is no different from metal electroplating. The problems in the process of using after …